Kernow North America will introduce its printable metallic and holographic board stock alongside a limited-edition trading card giveaway at PRINTING United Expo
Kernow North America has announced the official launch of KernowJet Unifoil Silver and Rainbow Board at PRINTING United Expo 2026, taking place from 23 to 25 September at the Las Vegas Convention Center. Exhibiting at Booth C1873, Kernow North America will showcase the new range of printable metallic and holographic board stock engineered for luxury packaging, folding cartons, trading cards, point-of-sale displays, and high-impact promotional print.
KernowJet Unifoil is available in two distinct finishes: a highly reflective Silver stock and a Rainbow holographic finish. Developed to eliminate the operational complexity and expense of traditional foil stamping, the substrate allows print service providers, packaging converters, and designers to achieve metallic and holographic visual effects directly on an easy-to-print board stock.
Kernow North America has also collaborated with Unifoil, Color-Logic, Leaf Trading Cards, and commercial printer Lithographix to create an exclusive collectible trading card giveaway for show attendees. Printed by Lithographix on KernowJet Unifoil Rainbow Board, the commemorative cards feature custom artwork embellished using Color-Logic software to generate metallic colours, shimmering effects, and multi-dimensional visual depth.
Leaf Trading Cards provided the collectible framework for the promotion, drawing on its long-standing heritage in sports and entertainment trading cards dating back to 1948. The finished cards demonstrate how advanced media substrates, colour management software, and high-precision print production can combine to create premium, highly embellished keepsakes.
Kernow North America will present the Unifoil range alongside its broader portfolio of sustainable and specialist printable media. Technical specialists from Kernow North America will be present at Booth C1873 throughout the three-day event to conduct live application demonstrations and discuss substrate specification for custom packaging and display projects.